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Презентация на тему ESD Class 0 Protection Stress Levels

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2. ESD Event ClassificationFrom EMI to EOS -
3. *NASA Workmanship StandardsIntroduction 1What is an ESD
4. *NASA Workmanship StandardsOverview ESD Models Provide a
5. *NASA Workmanship StandardsPurpose of ESD Models Models
6. *NASA Workmanship Standards Human Body (HBM): discharging
7. ESD Damage to Die StructureDamage types can
8. ESD Sensitivity Levels*NASA Workmanship Standards
9. *NASA Workmanship StandardsWhite Paper 2: A Case
10. *NASA Workmanship StandardsModels ComparisonsCourtesy of ESDA
11. ESD Models vs. Sources of Threats*NASA Workmanship Standards
12. “Class 0” Parts Protection“Class 0” has become
13. Model Implementation NASA-HDBK-8739.21 (in Approval Cycle) Guide
14. Model ImplementationRecent failures of high speed devices
15. Class 0 & CDMClass 0 refers to
16. Limits of Design-in ProtectionCDM protection by the
17. Protection of Devices Sensitive to Class 0
18. External ESD Control Measures for Extremely Sensitive Devices *NASA Workmanship Standards
19. Charged Board EventsCBE are caused when a
20. *NASA Workmanship StandardsWhere to Get More InformationWEB
21. *NASA Workmanship StandardsReferencesANSI/ESD STM5.1-2001 ESD Sensitivity Testing
22. Thank you Any Questions?*NASA Workmanship Standards
23. *NASA Workmanship StandardsTypical HBM Generated Failures2000X100XCourtesy of JPLScott M. Hull NASA/GSFC
24. *NASA Workmanship StandardsTypical MM ESD Stress FailureScott M. Hull NASA/GSFC
25. *NASA Workmanship StandardsTypical CDM generated failures 4600x8600xCourtesy of JPLCourtesy of JPL
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ESD Event ClassificationFrom EMI to EOS - Speed ClassificationEMI caused ESD has short and repetitive pulses with low energy.EOS is and ESD event with unlimited Current/Time constrainsHBM, MM & CDM model typical events in the manufacturing

*NASA Workmanship StandardsJosé D. SanchoESD Class 0 Protection Stress Levels Their Origin and Application

*NASA Workmanship StandardsIntroduction 1What is an ESD Sensitivity Level?2How is it obtained?3Why

*NASA Workmanship StandardsOverview ESD Models Provide a way to characterize the sensitivity

*NASA Workmanship StandardsPurpose of ESD Models Models establish Benchmarks for ESD Sensitivity.Different

*NASA Workmanship Standards Human Body (HBM): discharging event through the body and

ESD Damage to Die StructureDamage types can vary depending on event models.

ESD Sensitivity Levels*NASA Workmanship Standards

*NASA Workmanship StandardsWhite Paper 2: A Case for Lowering Component Level CDM

*NASA Workmanship StandardsModels ComparisonsCourtesy of ESDA

ESD Models vs. Sources of Threats*NASA Workmanship Standards

“Class 0” Parts Protection“Class 0” has become the generic term to define

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Class 0 & CDMClass 0 refers to the HBM modelCurrently most ESD

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Protection of Devices Sensitive to Class 0 ESD “Shalls” related to HBM

External ESD Control Measures for Extremely Sensitive Devices *NASA Workmanship Standards

Charged Board EventsCBE are caused when a board is pulled from the

*NASA Workmanship StandardsWhere to Get More InformationWEB searches under “ESD Models”ESDA publicationsConsulting

*NASA Workmanship StandardsReferencesANSI/ESD STM5.1-2001 ESD Sensitivity Testing (HBM)ANSI/ESD STM5.2-1999 ESD Sensitivity Testing

Thank you Any Questions?*NASA Workmanship Standards

*NASA Workmanship StandardsTypical HBM Generated Failures2000X100XCourtesy of JPLScott M. Hull NASA/GSFC

*NASA Workmanship StandardsTypical MM ESD Stress FailureScott M. Hull NASA/GSFC

*NASA Workmanship StandardsTypical CDM generated failures 4600x8600xCourtesy of JPLCourtesy of JPL

*NASA Workmanship StandardsTypical CDM Generated FailureCourtesy of Frederick Felt GSFC Part Analysis

Слайды презентации

Слайд 2 ESD Event Classification
From EMI to EOS - Speed

ESD Event ClassificationFrom EMI to EOS - Speed ClassificationEMI caused ESD

Classification
EMI caused ESD has short and repetitive pulses with

low energy.
EOS is and ESD event with unlimited Current/Time constrains
HBM, MM & CDM model typical events in the manufacturing areas.

NASA Workmanship Standards

Слайд 3 *
NASA Workmanship Standards
Introduction
1What is an ESD Sensitivity

Level?
2How is it obtained?
3Why is it important to the

user?
4Why different test models?

Слайд 4 *
NASA Workmanship Standards
Overview
ESD Models Provide a way

*NASA Workmanship StandardsOverview ESD Models Provide a way to characterize the

to characterize the sensitivity of components to ESD
The different

ESD models simulate the different environments experienced by electronic components during the manufacturing process.
Parts and assemblies may be exposed to more than one type of ESD event over the manufacturing and test life cycle.

CDM

HBM

ESD Models:
(differences & interrelation)

Слайд 5 *
NASA Workmanship Standards
Purpose of ESD Models
Models establish

*NASA Workmanship StandardsPurpose of ESD Models Models establish Benchmarks for ESD

Benchmarks for ESD Sensitivity.
Different Models are used to simulate

different work environments.
Models provide help to prevent and analyze ESD Failures

Слайд 6 *
NASA Workmanship Standards
Human Body (HBM): discharging event

*NASA Workmanship Standards Human Body (HBM): discharging event through the body

through the body and the part to ground.
Machine

(MM): discharge voltage through automated handling equipment or hand-tools and the part to ground.
Charged Device (CDM): discharge into or out of a part due to charge accumulation within the part itself.

ESD Event Test Models

Слайд 7 ESD Damage to Die Structure
Damage types can vary

ESD Damage to Die StructureDamage types can vary depending on event

depending on event models.
Long, higher Voltage HBM event

can look like electrical overstress at die periphery.
Fast, high Current CDM event causes defects in core area which can be latent failures.
Must use advanced FA techniques to locate sites.

A Comparison of Electrostatic Discharge Models and Failure Signatures for CMOS Integrated Circuit Devices, M. Kelly, G. Servais, T. Diep, S. Twerefour, D. Lin, G. Shah, EOS/ESD Symposium 95

NASA Workmanship Standards

Слайд 8 ESD Sensitivity Levels
*
NASA Workmanship Standards

Слайд 9 *
NASA Workmanship Standards
White Paper 2: A Case for

*NASA Workmanship StandardsWhite Paper 2: A Case for Lowering Component Level

Lowering Component Level CDM ESD Specifications and Requirements, Industry

Council on ESD Target Levels, March 2009

Слайд 10 *
NASA Workmanship Standards
Models Comparisons
Courtesy of ESDA

Слайд 11 ESD Models vs. Sources of Threats
*
NASA Workmanship Standards

Слайд 12 “Class 0” Parts Protection
“Class 0” has become the

“Class 0” Parts Protection“Class 0” has become the generic term to

generic term to define parts which are very sensitive

to ESD.
It now encompass parts sensitive to HBM <250v as well as parts damaged by EMI
Sensitivity for these parts needs to be also defined using CDM classifications.
{EPAs as currently implemented at GSFC can protect parts sensitive to ~100 V HBM}

NASA Workmanship Standards

Слайд 13 Model Implementation
NASA-HDBK-8739.21 (in Approval Cycle) Guide for

Model Implementation NASA-HDBK-8739.21 (in Approval Cycle) Guide for Creating an ANSI/ESD

Creating an ANSI/ESD S20.20 Implementation Plan
Focus is on

HBM: emphasis on operator grounding, dissipative surfaces, reduction of triboelectric charging
For HBM & MM the methods for protective practices and creating protective spaces are highly reproducible and “low tech”
Proper implementation requires training and follow-up
HBM safety methods have brought HBM & MM failures down (now are ~10% of failures encountered industry-wide)

NASA Workmanship Standards

Слайд 14 Model Implementation
Recent failures of high speed devices (LVDS,

Model ImplementationRecent failures of high speed devices (LVDS, FPGAs) drive users

FPGAs) drive users to Class 0 HBM…
…But IC manufacturers

calculate that about 90% of the failures from the field are due to CDM ESD events.
CDM-related field returns are associated with low, medium, and high sensitivity devices.
Safety methods for CDM are highly customized because the model is less mature (many unknown variables and variable relationships, rapidly changing characteristics

NASA Workmanship Standards

Слайд 15 Class 0 & CDM
Class 0 refers to the

Class 0 & CDMClass 0 refers to the HBM modelCurrently most

HBM model
Currently most ESD damage is caused by much

shorter pulses best defined in the CDM model.
ESD pulses can be clamped by internal shunts and bypasses at the expense of design complexity and speed.
There is a limit beyond which the device cannot be internally protected.

NASA Workmanship Standards

Слайд 16 Limits of Design-in Protection
CDM protection by the design

Limits of Design-in ProtectionCDM protection by the design is driven by

is driven by the peak current from the IC

package discharge at the CDM voltage targeted.
The larger the package the higher the peak current of the CDM pulse created.
The smaller the geometry of the circuit the lower the breakdown voltage of the circuit
Present Theoretical Limit ≈ 125v CDM

NASA Workmanship Standards

Слайд 17 Protection of Devices Sensitive to Class 0 ESD

Protection of Devices Sensitive to Class 0 ESD “Shalls” related to

“Shalls” related to HBM Class 0 protection:
Dissipative chairs

and stools
Conductive or dissipative floors or floor mats
Relative humidity
Ionizers
Smocks
Procedures for Mating and de-mating of harnesses
Soldering iron testing
Signage

NASA Workmanship Standards

Слайд 18 External ESD Control Measures for Extremely Sensitive Devices

*
NASA Workmanship Standards

Слайд 19 Charged Board Events
CBE are caused when a board

Charged Board EventsCBE are caused when a board is pulled from

is pulled from the bag and place on a

conductive surface
This ESD hazard was often overlooked
During FA the components failure is usually classified as EOS damage.
Recent data reported by several Companies indicates that CBEs are commonly missed in FA

NASA Workmanship Standards

Слайд 20 *
NASA Workmanship Standards
Where to Get More Information
WEB searches

under “ESD Models”
ESDA publications
Consulting services provide Advice on tough

ESD problems and Solutions.

Слайд 21 *
NASA Workmanship Standards
References
ANSI/ESD STM5.1-2001 ESD Sensitivity Testing (HBM)
ANSI/ESD

*NASA Workmanship StandardsReferencesANSI/ESD STM5.1-2001 ESD Sensitivity Testing (HBM)ANSI/ESD STM5.2-1999 ESD Sensitivity

STM5.2-1999 ESD Sensitivity Testing (MM)
ANSI/ESD STM5.3.1-1999 ESD Sensitivity Testing

(CDM)
ANSI/ESD SP5.2.2-2004 ESD Sensitivity Testing (SDM)
ANSI/ESD SP5.5.1-2004 ESD Sensitivity Testing (TPL)
Scott M. Hull, “ESD Failures in Thin-Film Resistors” NASA/Goddard Space Flight Center
http://esdsystems.com/whitepapers/
http://www.semiconfareast.com
http://www.ce-mag.com/archive/01/09/henry.html
http://www.ce-mag.com/ce-mag.com/archive/01/03/0103CE_046.html
White Paper: Industry Council on ESD Target Levels on CDM
http://ossma-dev.gsfc.nasa.gov/ESDResources/index.php
https://ossmacm.gsfc.nasa.gov/