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Презентация на тему Supermicro New Product Introduction

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Naples Product Overview
Supermicro New Product IntroductionEvgeniy Borisov2017 Naples Product Overview 20152017/Future2016UPSingle AMD Socket G34 Opteron 6000 series256GB ECC U/RDDR3 1600/1333/1066 in 8 20152017/Future2016GPUWIO/UltraAMD SR5690 chipsetPR: Sep/’10 H8DGU-LN4F+Dual AMD Socket G34 Opteron 6000 series 768GB ECC NVLINKPCIETESLA P100 ACCELERATORS ConfidentialThe Latest GPU Solutions1028GQ-TXR1U ChassisDual HSW/BDW CPUs16 DDR4 DIMMs2 2.5” HS HDD v4 BROADWELL READY22 Cores / 44 Threads2400Mhz Memory40% performance over v3PASCAL GPU Key Features:PERFORMANCE: 170 TFlops with 8x Pascal GPUsHYPERSCALE: 80GB/s NVLINK with Cube ConfidentialAll Specifications are subject to changex16x12x SATAdomC620SerialSATA 0-3SATA 4-7AST2500USBIPMI 3.0 LANMicro SDBMCVGAx16x8x8Key 1236784123467Key Features:Dual Power8+ Processor, X-Bus up to 4.8GT/s, 190W TDP32 x DDR4 Confidential4U DP SYS-4029GR-TR(T)2 ConfidentialSingle-Root DesignLatency winner ConfidentialX10 GPU Server PortfolioRatio: GPU:CPUTOWERRACKDEEP LEARNINGGPU OPTIMIZED2:42:82:42:42:102:62:82:41:2 Model Name SYS-5028TK-HTRKey featuresDensity: Uses popular Twin architecture to achieve 4 hot-pluggable Single port Omni-Path PCIe card is available today…+2nd LP PCIe 3.0 x16 Supermicro Omni-Path PortfolioEdge Switch - SSH-C48QKey featuresOmni-Path: 48 100 Gbps ports (QSFP28)Bandwidth: Model Name SYS-5038K-iForm Factor: ATX Mid Tower chassis●●Quiet Operation: Under 31 dBA Eight sockets with up to 192 processor cores, 384 threads192 DDR4 Memory 4 hot-swappable nodes in 2UUp to 3TB DDR4-2400 in 24 DIMM per Dual E5-2600 v4 CPU Up to TDP 205W 24 DDR4 memory Up 2U SBB Dual Port NVMeSSG-2028R-DN2R20LApplications:All Flash Array Platform (OEM)HPC Storage (Lustre)Database Applications ConfidentialSuper I/O Module (SIOM)AOC-MTG-i4SQuad port 10G (SFP+)Intel XL710-AM1 controllerAOC-MTGN-i2SDual port 10G (SFP+) Grantley and Purley Platform Comparisons Applications/VerticalsB2/R-Socket LGA-1356/2011R3-Socket LGA-2011P-Socket LGA-3647X11DSCX11DSC-SX11DSN-TSX11DDW-L/NTX9DBS-FX10DSC+X10DSC-TP4SX10DSN-TSX10DRSDP MB (X9-X10-X11) Transition Chart 4 hot-swappable nodes in 2UUp to 3TB DDR4-2666 in 24 DIMM per SYS-2029TP-HTR/HC1R/HC0R6x 2.5” Hot-Swap Drive Bays (per node)Up to 2TB DDR4-2666 in 16 8 2.5” Hot-Swap Drive Bays in 1UOptional LSI 3108 AOMUp to 1.5TB X11 Mainstream Early Ship SKUs8 3.5” Hot-Swap SATA3 Drive Bays in 2UCost X11 Ultra Early Ship SKUs 10 2.5” Hot-Swap Drive Bays in 1UOptional 20 hot-swappable 2-socket (205W CPU) nodes in 8UUp to 2TB DDR4-2666 in UP E5 (X9-X10-X11)2019High Performance Xeon Enterprise Server MBX11SPi-TF Skylake/Cannonlake (C622)1TB DDR4 LRDIMM 3DS, QSV & VHD Системы ConfidentialXeon + FPGA201520162017 201820192020Broadwell + Arria10 FPGA MCPSkylake + Arria10 FPGA MCP100GbE supportTDP+ ConfidentialComplete installation – March., 2015~438 compute nodes, including SuperBlades (TwinBlade) ,GPU/Xeon Phi ConfidentialSupermicro RACK solution group built a 570 node FatTwin™ - 4U 8-node 53498410W ClientUP Embedded 2017 Roadmap13-30W Atom ServerIoTCtrl Box Q1 ’16Q4 ’16X11SSNX11SSNQ2 ’1617-35W FanlessEmbedded Sys. Low power consumption Wide operating temp -20-60C for harsh environmentVESA/Wall SYS-E100-9APAntennaDual GbE LANDual USB3.0HDMIVGADC-IN 12VDIO4x USB2.04x COM A2SAN-H/L/EApollo Lake 4-Core, 3.5” SBC, Wide Temp. USB 3.1, M.2 & Mini-PCIeSelling A2SDi-2C/4C/8C+/12C-HLN4FDenverton 2-12-Core, Quad GbESelling Points:Atom C3000 SoC, 2-12 Core, 8.5-25WDenverton 64-bit 14nm A2SDi-H-TP4FDenverton 16-Core, Quad 10GbE (SFP+ & 10GBaseT), 12x SATA3Selling Points:Atom C3000 SoC, Как насчет большего хранения?Hot-swap2.5” driveHot-swap2.5” driveExample: SC813M Корзины с горячей заменой Slim Floppy Size (MCP-220-81504-0N)Slim DVD Size (MCP-220-81506-0N)Active (Blue)Status (Red)Active (Blue)Status (Red) NVMe становится доступнееSupport 2.5” NVMe Drives x2Point-to-point direct attached backplane supports NVMeLED SYS-1028U-TN20R25M+ 20 hot-swap 2.5” NVMe drives support24 DIMM, 3TB ECC 3DS LRDIMM Intel 200W Processors SupportNew Intel 200W ProcessorHigh Cores: 20Higher Frequency: 2.5GHz (3.2 Спасибо завнимание
Слайды презентации

Слайд 2

Слайд 3

Слайд 4









Naples Product Overview

Naples Product Overview

Слайд 5


2015
2017/Future
2016


UP



Single AMD Socket G34 Opteron 6000 series
256GB ECC

20152017/Future2016UPSingle AMD Socket G34 Opteron 6000 series256GB ECC U/RDDR3 1600/1333/1066 in

U/RDDR3 1600/1333/1066 in 8 DIMM
H8SGL(-F)
AMD SR5650 chipset
PR: Mar/’10


Single AMD

Socket SP3 “Zen” x86 cores
8 channel DDR4 with ECC up to 2666MHz in 8 DIMM

SoC – No Chipset

New

H11SSL-i(N)

EATX



Dual AMD SR5690 chipset

PR: Sep/’10 H8DG6/i(-F)
Dual AMD Socket G34 Opteron 6000 series 512GB ECC U/RDDR3 1600/1333/1066 in 16 DIMM



Dual AMD Socket SP3 “Zen” x86 cores
8 channel DDR4 with ECC up to 2666MHz in 16 DIMM

SoC – No Chipset

New

H11DSi-(N)(T)

TwinPro


AMD SR5690 chipset

H8DGT-HL(IBQ)F


Dual AMD Socket G34 Opteron 6000 series 256GB ECC U/RDDR3 1866/1600/1333/1066 in 8 DIMM

PR: Sep/’11


AMD SR5670 chipset


PR: Nov/’10 H8DGT-H(IBQ)F
Dual AMD Socket G34 Opteron 6000 series
512GB ECC U/RDDR3 1600/1333/1066 in 16 DIMM



Dual AMD Socket SP3 “Zen” x86 cores
8 channel DDR4 with ECC up to 2666MHz in 16 DIMM

(Specifications subject to change without
notice. Please contact your sales rep for possible updates.)

SoC – No Chipset

New

H11DST-PS

Слайд 6



2015
2017/Future
2016


GPU
WIO/
Ultra


AMD SR5690 chipset
PR: Sep/’10 H8DGU-LN4F+
Dual AMD Socket G34 Opteron

20152017/Future2016GPUWIO/UltraAMD SR5690 chipsetPR: Sep/’10 H8DGU-LN4F+Dual AMD Socket G34 Opteron 6000 series 768GB

6000 series 768GB ECC U/RDDR3 1600/1333/1066 in 24 DIMM


AMD

SR5670 chipset

PR: Mar/’10 H8DGU(-F)
Dual AMD Socket G34 Opteron 6000 series
512GB ECC U/RDDR3 1600/1333/1066 in 16 DIMM


Dual AMD SR5690 chipset

H8DGG-QF


Dual AMD Socket G34 Opteron 6000 series 512GB ECC U/RDDR3 1600/1333/1066 in 16 DIMM

PR: May/’10



Dual AMD Socket SP3 “Zen” x86 cores
8 channel DDR4 with ECC up to 2666MHz in 16 DIMM

SoC – No Chipset

New

H11DSQ



Dual AMD Socket SP3 “Zen” x86 cores
8 channel DDR4 with ECC up to 2666MHz in 32 DIMM

SoC – No Chipset

New

H11DSU-i(N)+



Dual AMD Socket SP3 “Zen” x86 cores
8 channel DDR4 with ECC up to 2666MHz in 16 DIMM

(Specifications subject to change without
notice. Please contact your sales rep for possible updates.)

SoC – No Chipset

New

H11DSW-i(T)

Слайд 7




NVLINK
PCIE
TESLA P100 ACCELERATORS

NVLINKPCIETESLA P100 ACCELERATORS

Слайд 8 Confidential
The Latest GPU Solutions


1028GQ-TXR

1U Chassis
Dual HSW/BDW CPUs
16 DDR4

ConfidentialThe Latest GPU Solutions1028GQ-TXR1U ChassisDual HSW/BDW CPUs16 DDR4 DIMMs2 2.5” HS

DIMMs
2 2.5” HS HDD bays
4 Pascal w/ 40GB/s NVLink
3/1

x16/x8 PCIe 3.0 slot
2 2000W Titanium PWS

Scalability


4028GR-TR2

4U Chassis
Dual HSW/BDW CPUs
24 DDR4 DIMMs
24 2.5” HS HDD bays
10 Double-Wide GPUs
● 11/1 x16/x8 PCIe 3.0 slot;
4 (2+2) 2000W Titanium PWS

Flexibility



10



4





4028GR-TXR


4U Chassis
Dual HSW/BDW CPUs
24 DDR4 DIMMs
16 2.5” HS HDD bays
8 Pascal w/ 20GB/s NVLink
4/2 x16/x8 PCIe 3.0 slot
4 (2+2) 2000W Titanium PWS

HyperScale



8


NVlink Enabled GPU Solutions (x86)


Слайд 9














v4 BROADWELL READY
22 Cores / 44 Threads
2400Mhz Memory
40%

v4 BROADWELL READY22 Cores / 44 Threads2400Mhz Memory40% performance over v3PASCAL

performance over v3






















PASCAL GPU READY
Performance – 21 TFLOPs FP16
NVLink

– 5x PCIe
3D Memory - 2x Memory Bandwidth







































X10 SUPERMICRO ADVANTAGE
PERFORMANCE: 85TFLOPs Performance
NVLINK: Exactly the best 80GB/s GPU Bandwidth
GPU RDMA: Direct Internode GPU Interconnect
EFFICIENCY: Titanium-rated Power Supply
DESIGN: No GPU preheating




















ADVANTAGES

All GPUs capable of Peer-to-Peer direct access to all other GPUs’ memory as well as direct transfer operations via NVLink at high Bandwidth
High performance for collective communications
PCIe bandwidth fully available for host and/or NIC communication during inter-GPU communication









Unparalleled 1U platform for the highest parallel applications. No one else can do so much in
a 1U!!!! Up to Pascals with NVLink in , supporting Optimized GPU RDMA

SYS-1028GQ-TXR / TXRT

Слайд 10





























Key Features:
PERFORMANCE: 170 TFlops with 8x Pascal GPUs
HYPERSCALE:

Key Features:PERFORMANCE: 170 TFlops with 8x Pascal GPUsHYPERSCALE: 80GB/s NVLINK with

80GB/s NVLINK with Cube mesh architecture
RDMA FABRIC: Lowest latency

of data access and transfer
DESIGN: Independent GPU and CPU thermal zones


1


2

3

4

5

6
NVLINK ARCHITECTURE: CUBE MESH
7





SYS-4028GR-TXR

Слайд 11 Confidential

All Specifications are subject to change




x16



x1




2x SATAdom

C620



Serial
SATA 0-3
SATA

ConfidentialAll Specifications are subject to changex16x12x SATAdomC620SerialSATA 0-3SATA 4-7AST2500USBIPMI 3.0 LANMicro

4-7
AST2500





USB
IPMI 3.0 LAN




Micro SD
BMC
VGA

x16
x8
x8








Key Features:
Dual EP E5-2600 v4 Broadwell

(Socket R3 up to 160W TDP)
Intel C612 Chipset
24 DIMM, 3 TB Reg. ECC DDR4 up to 2400 MT/s, Supports NVM DIMM
4 PCI-E 3.0 x16 to BPN for Pascal support
2 PCI-E 3.0 x8 for additional expansion
Dual port i350 or Dual Port X55010Gb LAN from PCH
10 SATA 3 ports (includes 2 SATADOM), 3 ports USB 3.0 (2 rear + 1 Type A)
15.0” x 17.0” Form Factor





I350 X550


x4











CPU2


CPU1

Main Board: X10DGO

x16

x16













17.6”




8x HDD

8x P100 GPU
4U






30”


x16




x16

8x HDD


Слайд 12

1

2

3

6

7

8

4



1

2

3

4

6

7
Key Features:
Dual Power8+ Processor, X-Bus up to 4.8GT/s,

1236784123467Key Features:Dual Power8+ Processor, X-Bus up to 4.8GT/s, 190W TDP32 x

190W TDP
32 x DDR4 ECC DIMMs, up to 1600MHz
4

Nvidia SXM2 GPU up to 19.2GT/s
• 1 PCI-E 3.0 (x16/x8x8), 1 PCI-E 3.0(x8), 1 PCI-E 3.0(x16)


8


5


5


POWER8 CPU


P100
GPU


P100
GPU



NVLINK







80GB/s

80GB/s



X-Bus


POWER8 CPU


P100 GPU


P100 GPU



NVLINK







80GB/s

80GB/s



Memory

115GB/s
Memory

115GB/s





SSP-2028G-TR4T

Слайд 13 Confidential

4U DP SYS-4029GR-TR(T)2







Confidential4U DP SYS-4029GR-TR(T)2

Слайд 14 Confidential



Single-Root Design


Latency winner


ConfidentialSingle-Root DesignLatency winner

Слайд 15 Confidential
X10 GPU Server Portfolio









Ratio: GPU:CPU

TOWER

RACK

DEEP LEARNING

GPU OPTIMIZED



2:4
2:8
2:4
2:4
2:10
2:6
2:8
2:4
1:2

ConfidentialX10 GPU Server PortfolioRatio: GPU:CPUTOWERRACKDEEP LEARNINGGPU OPTIMIZED2:42:82:42:42:102:62:82:41:2

Слайд 16



Model Name SYS-5028TK-HTR




Key features
Density: Uses popular Twin architecture

Model Name SYS-5028TK-HTRKey featuresDensity: Uses popular Twin architecture to achieve 4

to achieve 4 hot-pluggable nodes in 2U
Processor support: Full

range of KNL and KNL-F SKUs supported
Flexible I/O support: Integrated dual-port Omni-Path or two low profile PCIe 3.0 x16 slots



Xeon Phi 2U Twin2 Server

Слайд 17 Single port Omni-Path PCIe card is available today…

+
2nd

Single port Omni-Path PCIe card is available today…+2nd LP PCIe 3.0

LP PCIe 3.0 x16 card
AOC-SHFI-i1C

… and there will be

SKUs with integrated dual port Omni-Path!


Intel Fabric Passive (IFP) Cable


Intel Fabric Through (IFT) Carrier Card AOC-SKL2Q


KNL-F
(with fabric)

Options for Omni-Path with KNL

Слайд 18 Supermicro Omni-Path Portfolio




Edge Switch - SSH-C48Q




Key features
Omni-Path: 48

Supermicro Omni-Path PortfolioEdge Switch - SSH-C48QKey featuresOmni-Path: 48 100 Gbps ports

100 Gbps ports (QSFP28)
Bandwidth: 9.6 Tbps fabric bandwidth
OOB: via

optional module (AOM-QA338152G)






x16 PCIe Card - AOC-SHFI-I1C






Key features
Omni-Path: Single QSFP28 Connector
Power Efficiency: 11.7 W copper; 14.9 W optical
Optimized for HPC: 8K and 10K MTUs









Carrier Card - AOC-SKL2Q

Key features
Omni-Path: 2 100 Gbps ports (QSFP28)
Support: Integrated fabric SKUs
Cost: Lower than discrete components


Слайд 19





Model Name SYS-5038K-i
Form Factor: ATX Mid Tower chassis
●
●
Quiet

Model Name SYS-5038K-iForm Factor: ATX Mid Tower chassis●●Quiet Operation: Under 31

Operation: Under 31 dBA at 80% load (215 W

SKUs)
Cooling System: Closed loop, maintenance free liquid cooling solution





Key features

Xeon Phi Development System

Слайд 20
Eight sockets with up to 192 processor cores,

Eight sockets with up to 192 processor cores, 384 threads192 DDR4

384 threads
192 DDR4 Memory DIMM slots, up to 24TB


Up to 12 x 2.5” hot swap SAS3 HDD via AOC
Up to 15 or 23(OEM) x PCI-e Gen 3 slots support
Up to 16 x U.2 NVMe support available
Up to 5 x 1600W 80Plus Titanium Level Power Supply


In- Memory database application
ERP, CRM and Business intelligence database application
Scientific Research
Scale-up HPC
Virtualization

SYS-7088B-TR4FT

EX 7U X10 8-Way DDR4 SYS-7088B-TR4FT

Слайд 21 4 hot-swappable nodes in 2U
Up to 3TB DDR4-2400

4 hot-swappable nodes in 2UUp to 3TB DDR4-2400 in 24 DIMM

in 24 DIMM per node
6 NVMe per node. 2

optional M.2 NVMe/SATA
SIOM for flexible network
2 PCI-e x16 expansion slots
Redundant 2600W/2200W Power Supplies

SYS-2028BT-HNR+

SYS-2028BT-HTR+

4 hot-swappable nodes in 2U
Up to 3TB DDR4-2400 in 24 DIMM per node
6 SAS/SATA per node. 2 optional M.2 NVMe/SATA
SIOM for flexible network
2 PCI-e x16 expansion slots
Redundant 2600W/2200W Power Supplies

Available NOW!

BigTwin

Слайд 22 Dual E5-2600 v4 CPU
Up to TDP 205W

Dual E5-2600 v4 CPU Up to TDP 205W 24 DDR4 memory


24 DDR4 memory
Up to 3TB; 2400MHz
High efficient
Air

shroud

SIOM flexible networking cards

2 low profile PCI-e x16
expansion slots

IPMI dedicated LAN

VGA

2 USB

2U BigTwin2 node

Слайд 23

Слайд 24 2U SBB Dual Port NVMe

SSG-2028R-DN2R20L
Applications:
All Flash Array Platform

2U SBB Dual Port NVMeSSG-2028R-DN2R20LApplications:All Flash Array Platform (OEM)HPC Storage (Lustre)Database

(OEM)
HPC Storage (Lustre)
Database Applications (MySQL, Cassandra)

1
2
3
4
5
5
1
2
3
4
5
Redundant High Availability Design


20 Dual Port Hot-swap NVMe bays
Redundant Hot-swap Dual Processor Servers
16x DIMM sockets per node (DDR4 up to 2400MHz)
Dedicated B2B connection using Intel XL710 10G private LAN
Omni-Path SIOM Support
2 PCI-E 3.0 (x8 , x16) expansion slots per node

3

KEY FEATURES

LAN - 2x 10GBase-T
2x SuperDOM Ports,
IPMI 2.0 (dedicated B2B) with Virtual Media/KVM over LAN
Node Manager Support
Dimensions: 25.6”(650mm) x 17.2”(437mm) x 3.5”(89mm)

Слайд 25 Confidential
Super I/O Module (SIOM)





AOC-MTG-i4S
Quad port 10G (SFP+)
Intel XL710-AM1

ConfidentialSuper I/O Module (SIOM)AOC-MTG-i4SQuad port 10G (SFP+)Intel XL710-AM1 controllerAOC-MTGN-i2SDual port 10G

controller
AOC-MTGN-i2S
Dual port 10G (SFP+) Intel 82599ES controller
AOC-MGP-i4
Quad port 1G

(RJ45)
Intel i350-AM4 controller

AOC-MGP-i2
Dual port 1G (RJ45)
Intel i350-AM2 controller



✔


AOC-M25G-b2S
Dual port 25G (SFP28) Broadcom controller



AOC-MTP-i4T
Quad port 10G (RJ45) Intel X550 controller

AOC-MTP-i2T
Dual port 10G (RJ45)
Intel X550 controller



AOC-MHIBF-2QG
Dual port FDR IB (QSFP) + Single port 1GbE
Mellanox ConnectX-3 controller

AOC-MHIBF-1QG
Single port FDR IB (QSFP) + Single port 1GbE
Mellanox ConnectX-3 controller


Under development: EDR, OPA





2U TwinPro2

SIOM Modular Networking

Highly flexible, Future proof, Cold swappable, Zero footprint design
x16 PCI-E 3.0 interface, NC-SI, direct-to-LAN PCH interface (X11 and beyond)
⮚ 1G/10GBase-T, 10G/25G/40G/50G/100G,
Infiniband EDR, OPA, SFP+, QSFP, and much more to come!

Wide Range of Choices, Flexible Configurations, Space Saving for Regular Add-on Cards,
Future Expandable, Better Cost Control and Inventory Management

Слайд 26 Grantley and Purley Platform Comparisons

Grantley and Purley Platform Comparisons

Слайд 27 Applications/Verticals
B2/R-Socket LGA-1356/2011
R3-Socket LGA-2011
P-Socket LGA-3647
X11DSC
X11DSC-S
X11DSN-TS

X11DDW-L/NT

X9DBS-F

X10DSC+
X10DSC-TP4S
X10DSN-TS
X10DRS
DP MB (X9-X10-X11) Transition Chart

Applications/VerticalsB2/R-Socket LGA-1356/2011R3-Socket LGA-2011P-Socket LGA-3647X11DSCX11DSC-SX11DSN-TSX11DDW-L/NTX9DBS-FX10DSC+X10DSC-TP4SX10DSN-TSX10DRSDP MB (X9-X10-X11) Transition Chart

Слайд 28
4 hot-swappable nodes in 2U
Up to 3TB DDR4-2666

4 hot-swappable nodes in 2UUp to 3TB DDR4-2666 in 24 DIMM

in 24 DIMM per node
6 NVMe per node. 2

optional M.2 NVMe/SATA
SIOM for flexible network
2 PCI-e x16 expansion slots
Redundant 2600W/2200W Power Supplies

Sampling: 5th Week of Dec. 2016
Volume Production: 1st Week of Feb. 2017


SYS-2029BT-HNR


SYS-2029BT-HTR

X11 BigTwin Early Ship SKUs


4 hot-swappable nodes in 2U
Up to 3TB DDR4-2666 in 24 DIMM per node
6 SAS/SATA per node. 2 optional M.2 NVMe/SATA
SIOM for flexible network
2 PCI-e x16 expansion slots
Redundant 2600W/2200W Power Supplies

Sampling: 5th Week of Dec. 2016
Volume Production: 1st Week of Feb. 2017

2600W/2200W Titanium level power stick module
45X40X480mm


Слайд 29
SYS-2029TP-HTR/HC1R/HC0R
6x 2.5” Hot-Swap Drive Bays (per node)
Up to

SYS-2029TP-HTR/HC1R/HC0R6x 2.5” Hot-Swap Drive Bays (per node)Up to 2TB DDR4-2666 in

2TB DDR4-2666 in 16 DIMM Slots
2x PCI-E 3.0 x16

Slots + 1x SIOM. 2 optional M.2 NVMe
HTR: Intel C620 for 6x 2.5" SATA3 (6 Gbps) ports
HC1R: Broadcom 3108 controller for 6x 2.5" SAS3(12 Gbps) ports
HC0R: Broadcom 3008 controller for 6x 2.5" SAS3(12 Gbps) ports
2200W Titanium level redundant power supplies


Sampling: 5th Week of Dec. 2016
Volume Production: 2nd Week of Feb. 2017

3x 3.5” Hot-Swap Drive Bays (per node)
Up to 2TB DDR4-2666 in 16 DIMM Slots
2x PCI-E 3.0 x16 Slots + 1x SIOM. 2 optional M.2 NVMe
HTR: Intel C620 for 3x 3.5" SATA3 (6 Gbps) ports
HC1R: Broadcom 3108 controller for 3x 3.5" SAS3(12 Gbps) ports
HC0R: Broadcom 3008 controller for 3x 3.5" SAS3(12 Gbps) ports
2200W Titanium level redundant power supplies


SYS-6029TP-HTR/HC1R/HC0R


Sampling: 5th Week of Dec. 2016
Volume Production: 2nd Week of Feb. 2017

X11 TwinPro2 Early Ship SKUs

Слайд 30
8 2.5” Hot-Swap Drive Bays in 1U
Optional LSI

8 2.5” Hot-Swap Drive Bays in 1UOptional LSI 3108 AOMUp to

3108 AOM
Up to 1.5TB DDR4-2666 in 12 DIMM Slots
3

PCI-E 3.0 Slots
2 GbE LAN Ports
Redundant 700W Platinum Power Supplies

Sampling: 3rd Week of Jan. 2017
Volume Production: 4th Week of Feb. 2017


SYS-1029P-WTR


SYS-6019P-WT


SYS-6019P-WTR

4 3.5” Hot-Swap Drive Bays in 1U
Cost effective
Up to 1.5TB DDR4-2666 in 12 DIMM Slots
3 PCI-E 3.0 Slots
2 GbE LAN Ports
600W Platinum Power Supplies

4 3.5” Hot-Swap Drive Bays in 1U
Optional LSI 3108 AOM
Up to 1.5TB DDR4-2666 in 12 DIMM Slots
3 PCI-E 3.0 Slots
2 GbE LAN Ports
Redundant 700W PlatinumPower Supplies


Sampling: 3rd Week of Jan. 2017
Volume Production: 4th Week of Feb. 2017


Sampling: 3rd Week of Jan. 2017
Volume Production: 4th Week of Feb. 2017

X11 WIO Early Ship SKUs

Слайд 31 X11 Mainstream Early Ship SKUs

8 3.5” Hot-Swap SATA3

X11 Mainstream Early Ship SKUs8 3.5” Hot-Swap SATA3 Drive Bays in

Drive Bays in 2U
Cost effective
Up to 2TB DDR4-2666 in

16 DIMM Slots
6 Low profile PCI-E 3.0, 4x16 and 2x8
1 M.2 NVMe (PCH)
2 10G based-T LAN Ports
Redundant 800W Titanium Power Supplies

Sampling: NOW
Volume Production: 4th Week of December


SYS-6029P-TRT


SYS-6029P-TR

8 3.5” Hot-Swap SATA3 Drive Bays in 2U
Cost effective
Up to 2TB DDR4-2666 in 16 DIMM Slots
6 Low profile PCI-E 3.0, 4x16 and 2x8
1 M.2 NVMe (PCH)
2 GbE LAN Ports
Redundant 800W Titanium Power Supplies


Sampling: NOW
Volume Production: 4th Week of December

Слайд 32 X11 Ultra Early Ship SKUs

10 2.5” Hot-Swap Drive

X11 Ultra Early Ship SKUs 10 2.5” Hot-Swap Drive Bays in

Bays in 1U
Optional 8 SAS3 (12Gb/s) + 2 NVMe/SATA3
Up

to 3TB DDR4-2666 in 24 DIMM Slots
4 PCI-E 3.0 Slots
4 GbE LAN Ports
Redundant 750W Platinum Power Supplies

Sampling: NOW
Volume Production: 4th Week of December


SYS-1029U-TR4+


SYS-6019U-TR4+


SYS-6029U-TR4+

4 3.5” Hot-Swap Drive Bays in 1U
Up to 3TB DDR4-2666 in 24 DIMM Slots
4 PCI-E 3.0 Slots
4 GbE LAN Ports
Redundant 750W Platinum Power Supplies

12 3.5” Hot-Swap Drive Bays in 2U
Optional 8 SAS3 + 4 NVMe/SAS3
Up to 3TB DDR4-2666 in 24 DIMM Slots
8 PCI-E 3.0 Slots
4 GbE LAN Ports
Redundant 1000W Titanium Power Supplies


Sampling: NOW
Volume Production: 4th Week of December


Sampling: NOW
Volume Production: 4th Week of December

Слайд 33
20 hot-swappable 2-socket (205W CPU) nodes in 8U
Up

20 hot-swappable 2-socket (205W CPU) nodes in 8UUp to 2TB DDR4-2666

to 2TB DDR4-2666 in 16 DIMM per node
2 NVMe/SAS3

or 3 SATA3 (2 can be NVMe) per node
4 M.2 NVMe per node
2x 10GbE+ 100G InfiniBand/Omnipath
8x 2200W Tittanium Power Supplies (N+N or N+1 Redundancy)

Sampling: 1st Week of Jan. 2017
Volume Production: 2nd Week of Feb. 2017


SBI-4129P-C2N/T3N


SBI-8149P-T8N/C4N

X11 SuperBlade Early Ship SKUs


10 hot-swappable 4-socket (205W CPU) nodes in 8U
Up to 6TB DDR4-2666 in 48 DIMM per node
8 NVMe/SATA3 or 4 NVMe/SAS3 per node
2 M.2 NVMe per node
4x 10GbE or 2x 10GbE+100G InfiniBand/Omnipath
8x 2200W Titanium Power Supplies (N+N or N+1 Redundancy)

Sampling: 1st Week of Apr. 2017
Volume Production: 1st Week of May. 2017

Слайд 34 UP E5 (X9-X10-X11)




2019








High Performance Xeon Enterprise Server MB




X11SPi-TF
Skylake/Cannonlake

UP E5 (X9-X10-X11)2019High Performance Xeon Enterprise Server MBX11SPi-TF Skylake/Cannonlake (C622)1TB DDR4 LRDIMM

(C622)
1TB DDR4 LRDIMM 3DS, 10G



X11SPL-F
Skylake/Cannonlake (C621)
1TB DDR4 LRDIMM 3DS,

1G, 7x PCIe Slots



Skylake/Cannonlake (C622)
1TB DDR4 LRDIMM 3DS, 10G, SAS



X11SPH-nCTF/-nCTPF


1TB DDR4 LRDIMM 3DS, 10G

X11SPG-TF
Skylake/Cannonlake (C622)



Skylake/Cannonlake (C622)
768GB DDR4 LRDIMM 3DS, 10G, mATX

X11SPM-TF/-TPF/-F



X11SPS-TF (SBB)
Skylake/Cannonlake (LBG-2) 1TB DDR4 LRDIMM 3DS, 10G


X11SPW-CTF/-TF
Skylake/Cannonlake (C622)
768GB DDR4 LRDIMM 3DS, 10G

New



X11SPM-LF/LVF (TBD)
Skylake/Cannonlake (C621)
512GB DDR4 LRDIMM 3DS, 1G, mATX








New





Applications, Selling Points



HPC, Virtualization



Low-cost, I/O Intensive



GPU, 1U/5AOC



Storage with SAS/10G/SFP+



SFF, HPC, Storage, 12V DC



Lowest-cost, mATX, VROC



WIO, 1U/3AOC




MB for System Solution. Not allow to sell MB alone.




Sandy Bridge/Ivy Bridge

C602, 256GB

X9SRi(RE)/-F/-3F

EOL




Sandy Bridge/Ivy Bridge

C602, 256GB

X9SRL /-F

EOL




Sandy Bridge/Ivy Bridge

C602, 256GB

X9SRW-F

EOL




Sandy Bridge/Ivy Bridge

C602j, 256GB

X9SRH-7F/-7TF




Sandy Bridge/Ivy Bridge

C602, 256GB

X9SRG-F

EOL

EOL










2012 2013 2014 2015 2016 2017 2018
R-Socket, LGA-2011 R3-Socket, LGA-2011 P-Socket, LGA-3647




HSW/BDW, R3-Skt, C612, 1TB DDR4

X10SRi-F




HSW/BDW, R3-Skt,

C612, 1TB DDR4

X10SRW-F




HSW/BDW, R3-Skt,

C612, 1TB DDR4

X10SRG-F




HSW/BDW, R3-Skt, C612, 1TB DDR4

X10SRH-CF/-CLN4F




HSW/BDW, R3-Skt,

C612, 1TB DDR4

X10SRL-F





C612, 512GB DDR4

X10SRM-F/-TF


HSW/BDW, R3-Skt,

New



SBB Storage

Слайд 35 QSV & VHD Системы





QSV & VHD Системы

Слайд 36 Confidential
Xeon + FPGA






















2015
2016
2017 2018
2019
2020


Broadwell + Arria10 FPGA MCP


Skylake +

ConfidentialXeon + FPGA201520162017 201820192020Broadwell + Arria10 FPGA MCPSkylake + Arria10 FPGA MCP100GbE

Arria10 FPGA MCP
100GbE support
TDP+ 235W


Ice Lake + FPGA MCP

Arria10 / Stratix10 100GbE support TDP+ 235W



Sapphire Rapids + FPGA

200GbE support





Ice Lake + FPGA Integrated on Purley


Pilot board: X11DPZ+
(Skylake+FPGA)







PCIe 3.0 x16





Prog I/F



UPI0



PCIe 3.0 x16



UPI1



DMI x4







UPI2 PCIe 3.0 x8
PCIe 3.0 x8


HSSI



SKL



FPGA





DDR4 DDR4 DDR4







DDR4 DDR4 DDR4

Слайд 37 Confidential

Complete installation – March., 2015
~438 compute nodes, including

ConfidentialComplete installation – March., 2015~438 compute nodes, including SuperBlades (TwinBlade) ,GPU/Xeon

SuperBlades (TwinBlade) ,
GPU/Xeon Phi nodes and FatTwin nodes
Performance =

>275 TFLOPS
Storage : 17 nodes (including 12 OSS nodes) = ~3PB
Infiniband FDR connectivity for compute
1G/10G Ethernet connectivity for management and storage

OIST (Okinawa Institute of Science and Technology)

































































































































































































































































































































































































































(240)


Core
Switches



Miscellaneous Nodes






(24)

(24)

(24)



DDN Storage Nodes
(31 ports used)






48 spare ports from Mellanox 324 SW

(12)

(12)

(12)
























Scheduling node
Monitoring node
Managementnode

Login node
Spare node

Installation Server

Large Memory node

Intel Phi node

Future expansionnode



2x 48-port 10G Switch

2x 48-port 1G Switches









































Each Blades can supportadditional 2x IB ports/nodes to maintain 50% blocking topology (because currentarchitecture is 12:20 blocking, adding additional 4 nodes will make the architecture 12:24 (50%) blocking)

















2x 48-port 1G Switches




2x 1G SFP+ Optical

to OIST OOB Network describedin “New Network
HPC connectivity with existing networks” file


16 x 10G SFP+ Optical
to four OIST Networks described in“New Network HPC connectivity with existing networks” file


Infiniband Network (Cluster Interconnect)
Management Network (IPMI) Ethernet Network (Provisioning e.t.c.) 10GbE Ethernet Network




















12 spare ports from TwinBlade



41 spare ports from Mellanox 36 SW



Compute nodes: TwinBlade



Слайд 38 Confidential
Supermicro RACK solution group built a 570 node

ConfidentialSupermicro RACK solution group built a 570 node FatTwin™ - 4U

FatTwin™ - 4U 8-node (Broadwell,E5-2695 v4, 560 compute nodes,

20,160 physical cores) with liquid chilled rack rear doors

The platform uses Intel 100Gbps Omni-path, Supermicro NVMe Drives with FatTwin solution.

The performance measured : 602.983TFLOPS --- Top500 ranked 166 (June, 2016)

Cooling solution: Active water rear door design

Rutgers U. – FatTwin™ + OPA Cluster







Слайд 39 534984
10W Client



UP Embedded 2017 Roadmap

13-30W Atom Server
IoT
Ctrl Box

53498410W ClientUP Embedded 2017 Roadmap13-30W Atom ServerIoTCtrl Box Q1 ’16Q4 ’16X11SSNX11SSNQ2


Q1 ’16

Q4 ’16
X11SSN
X11SSN
Q2 ’16

17-35W Core
Server
Communication
8-30W
Communication
15-45W

17-35W Core
vPro

DT LGA

Core
Mini-ITX


DT LGA Core
uATX, vPro


DT LGA Core
uATX


DT LGA Core
ATX, PCI

Q1 ’17


DT LGA Xeon/Core
uATX

Q2 ’17

Q3 ’17

Q4 ’17

Слайд 40


Fanless
Embedded Sys.
Low power consumption
Wide operating temp

FanlessEmbedded Sys. Low power consumption Wide operating temp -20-60C for harsh

-20-60C for harsh environment
VESA/Wall mount for easy deployment
SYS-E100-9AP
Atom SoC,

QC, 9W

Compact Box Sys.

SYS-E200-9AP
Atom SoC, QC, 9W

Mini Tower

SYS-5029AP-TN2
Atom SoC, QC, 9W

Building block design
Off-the-shelf with reliable product life cycle
VESA mount for easy deployment

4 x hot-swap 3.5” HDD with 2 internal 2.5” HDD
Low profile expansion slot for diversified application

Apollo Lake Solutions

Слайд 41 SYS-E100-9AP
Antenna
Dual GbE LAN
Dual USB3.0
HDMI
VGA
DC-IN 12V
DIO
4x USB2.0
4x COM

SYS-E100-9APAntennaDual GbE LANDual USB3.0HDMIVGADC-IN 12VDIO4x USB2.04x COM

Слайд 42 A2SAN-H/L/E
Apollo Lake 4-Core, 3.5” SBC, Wide Temp. USB

A2SAN-H/L/EApollo Lake 4-Core, 3.5” SBC, Wide Temp. USB 3.1, M.2 &

3.1, M.2 & Mini-PCIe
Selling Points:
Atom Apollo Lake-I SoC, up

to 4 Core, 9.5W, HD Graphics 500
3.5” SBC small form factor (4”x5.75”)
USB 3.1 type C, Dual channel 48-bit LVDS
2 LAN Ports, 1 SATA3 Ports, Wide Operating temperature Support ( -E/-L: -30 to 75C, -H: 0-60C )
4-Pin 12V DC
7 Years Product Life
Key Features:
Up to 8 GB DDR3L 1867MHz Non ECC SODIMM
HDMI, LVDS and VGA,
1x SATA3.0, 1x M.2 slot (B-key 2280 for SATA/PCIe SSD or WWAN/GNSS card), 2x USB3.0, 4x USB 2.0, 4x COM ports(2 with RS-232/422/485), 1x mini PCIe, audio, 8-bit GPIO, SMBus. TPM on board
Applications:
Industrial Automation, Transportation
Control Board





Optimized Server:
SYS-E100-9AP

Note: -E with quad core and without Audio/USB3.1/TPM, -L with dual Core and without Audio/USB3.1/TPM

NDA Sample in Jan’17
MP in March ’17

Слайд 43 A2SDi-2C/4C/8C+/12C-HLN4F
Denverton 2-12-Core, Quad GbE
Selling Points:
Atom C3000 SoC, 2-12

A2SDi-2C/4C/8C+/12C-HLN4FDenverton 2-12-Core, Quad GbESelling Points:Atom C3000 SoC, 2-12 Core, 8.5-25WDenverton 64-bit

Core, 8.5-25W
Denverton 64-bit 14nm System on Chip, VT-d/x, TXT,

AES-NI, built-in Quad GbE
Best Performance per Watt
Mini-ITX 6.7”x6.7” small form factor
IPMI 2.0 with KVM and dedicated port
4 GbE LAN Ports with RJ45
4-Pin 12V DC and ATX power source
7 Years Product Life
Key Features:
128 GB up to 2133MHz DDR4 RDIMM or 64GB UDIMM
12x SATA3.0, 1x M.2 slot (M key for SSD, 2242/80, PCIe3.0 x2 or SATA3), 1x USB3.0 type A, 4x USB 2.0, 1x PCIe 3.0 x4, Quad GbE LAN ports
Applications:
Network Security Appliance
Storage Server/Appliance






SuperServer:
SYS-5019A-2TN4(2C, SC721)
Optimized Chassis:
SC504/505 : 1U 9.8”
SCE300, 1U 10.0”x8.9”x1.7”
SC101F, 1U 7.68” x8.9”x1.7”

Sample in Jan’17
MP in Feb’17

Note: Some SKU may de-pop M.2 or SATA ports for limited SoC I/O support

Слайд 44 A2SDi-H-TP4F
Denverton 16-Core, Quad 10GbE (SFP+ & 10GBaseT), 12x

A2SDi-H-TP4FDenverton 16-Core, Quad 10GbE (SFP+ & 10GBaseT), 12x SATA3Selling Points:Atom C3000

SATA3
Selling Points:
Atom C3000 SoC, up to 16 Core, 35W
Denverton

64-bit 14nm System on Chip, VT-d/x, TXT, AES-NI, built-in 10GbE
Best Performance per Watt
Mini-ITX 6.7”x6.7” small form factor
IPMI 2.0 with KVM and dedicated port
4 LAN Ports with Dual 10GbE SFP+ and Dual 10GBaseT
4-Pin 12V DC and ATX power source
7 Years Product Life
Key Features:
128 GB up to 2133MHz DDR4 RDIMM or 64GB UDIMM
12x SATA3.0, 1x M.2 slot (M key for SSD, 2242/80, PCIe3.0 x2 or SATA3), 1x USB3.0, 4x USB 2.0, 1x PCIe 3.0 x4, Quad 10GbE LAN ports with 2x SFP+ and 2x 10GBase-T (SoC)
Applications:
Network Security Appliance
Storage Server/Appliance






Optimized Chassis:
SC801 : 1U 12x 3.5 HDD
SC504/505 : 1U 9.8”
SCE300, 1U 10.0”x8.9”x1.7”
SC101F, 1U 7.68” x8.9”x1.7”
SC721, 11”x8.2”x9.45”

Sample in January ‘16
MP in March ’17
A2SDi-H-TF with Dual 10GBaseT only

Слайд 45 Как насчет большего хранения?
Hot-swap
2.5” drive
Hot-swap
2.5” drive
Example: SC813M

Как насчет большего хранения?Hot-swap2.5” driveHot-swap2.5” driveExample: SC813M

Слайд 46 Корзины с горячей заменой
Slim Floppy Size
(MCP-220-81504-0N)
Slim

Корзины с горячей заменой Slim Floppy Size (MCP-220-81504-0N)Slim DVD Size (MCP-220-81506-0N)Active (Blue)Status (Red)Active (Blue)Status (Red)

DVD Size
(MCP-220-81506-0N)
Active (Blue)
Status (Red)
Active (Blue)
Status (Red)

Слайд 47 NVMe становится доступнее
Support 2.5” NVMe Drives x2
Point-to-point direct

NVMe становится доступнееSupport 2.5” NVMe Drives x2Point-to-point direct attached backplane supports

attached backplane supports NVMe
LED indicators for monitoring drive activity,

rebuild or failure
Reference MB configurations only for X10; all supported for X11.


1

2

3

4

5

6

SC216B, SC826B, SC826S, SC846X, SC847B, SC226S, SC417B
SC836B, SC835B (use MCP-220-82618-0N)


7

8

9

NVMe

NVMe

Слайд 48 SYS-1028U-TN20R25M+

20 hot-swap 2.5” NVMe drives support
24 DIMM,

SYS-1028U-TN20R25M+ 20 hot-swap 2.5” NVMe drives support24 DIMM, 3TB ECC 3DS

3TB ECC 3DS LRDIMM up to 2400MHz
Up to 2

PCI-E 3.0 Add-on cards
Optimized cooling (145W CPUs)
2 25G SFP28 Ethernet ports
Redundant Titanium level high efficiency digital power supply
2 SATA ports with built-in SATA DOM power Support

1

2

3

4

5

6

7

8

KEY FEATURES

Слайд 49





Intel 200W Processors Support
New Intel 200W Processor
High Cores:

Intel 200W Processors SupportNew Intel 200W ProcessorHigh Cores: 20Higher Frequency: 2.5GHz

20
Higher Frequency: 2.5GHz (3.2 GHz OC)
Better Cost
Consider if your

customer are using
E5-2698 v4: 20 core, 2.2GHz, 135W
E5-2699 v4: 22 core, 2.2GHz, 145W
Ultra Series Supports 200W CPU!
Optimized Design
Side by Side CPUs
Parallel Airflow
Quality Components
Optional: 1600W PSU

Слайд 50

Слайд 51 Спасибо
за
внимание

Спасибо завнимание

Слайд 52

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