Что такое findslide.org?

FindSlide.org - это сайт презентаций, докладов, шаблонов в формате PowerPoint.


Для правообладателей

Обратная связь

Email: Нажмите что бы посмотреть 

Яндекс.Метрика

Презентация на тему Silicon wafer separation

Content: Object of splittingWays of splittingResearch
Silicon wafer separation Content: Object of splittingWays of splittingResearch Object of splittingChemicalinteractionstrength limitDiameter: 50..300ммThickness: 100..1000mkmMax temperature difference(thermal cleavage)Properties Ways of splittingCutting with diamond bladeAbrasive-jet etchingChemical etchingLaser etchingUltrasonic drilling Advantages of abrasive-jet etchingYields per waferAny form of crystals(3,4,5,6-angles, circle)no pollution of Direction of process researchTesting of modesMathematical modeling of the process Thanks for watching!
Слайды презентации

Слайд 2 Content:
Object of splitting
Ways of splitting
Research

Content: Object of splittingWays of splittingResearch

Слайд 3 Object of splitting
Chemical
interaction
strength limit
Diameter: 50..300мм
Thickness: 100..1000mkm

Max temperature difference
(thermal

Object of splittingChemicalinteractionstrength limitDiameter: 50..300ммThickness: 100..1000mkmMax temperature difference(thermal cleavage)Properties

cleavage)
Properties


Слайд 4 Ways of splitting
Cutting with diamond blade
Abrasive-jet etching
Chemical etching
Laser

Ways of splittingCutting with diamond bladeAbrasive-jet etchingChemical etchingLaser etchingUltrasonic drilling

etching
Ultrasonic drilling


Слайд 5 Advantages of abrasive-jet etching
Yields per wafer
Any form of

Advantages of abrasive-jet etchingYields per waferAny form of crystals(3,4,5,6-angles, circle)no pollution

crystals(3,4,5,6-angles, circle)
no pollution of wafer
low cost process
high performance
the

ability to process plates of different thicknesses
environmentally friendly process

Слайд 6 Direction of process research
Testing of modes
Mathematical modeling of

Direction of process researchTesting of modesMathematical modeling of the process

the process


  • Имя файла: silicon-wafer-separation.pptx
  • Количество просмотров: 99
  • Количество скачиваний: 0
- Предыдущая Творчество Рериха
Следующая - Travelling to Knowledgeland